Improvement of Effectiveness of Cooling of Electronic Heat-Loaded Modules

Abstract

There has been developed, manufactured, and researched by numerical and experimental methods an operating sample of a typical construction of a cooling system of electronic heat-loaded modules of dual application, which can be used in devices of both special and civil purposes. The main idea of organizing an effective cooling is to provide heat transfer from a heat-loaded module, located in conditions where it is impossible to provide the thermal regime necessary for trouble-free operation, to an area where it is possible to organize the dissipation of the transported heat flow through free convection. A gravity-assisted heat pipe with a threaded capillary structure was used as a heat transfer device. As heat-loaded modules there were used powerful volumetric electronic modules made in the form of a prism with flat side faces, on which powerful semiconductor electronic components were installed. Due to application of a highly efficient closed evaporation-condensation cycle of heat transfer occurred in heat pipes, it became possible to increase the power of the electronic module in almost two times while keeping its temperature within the specified limits., graphical dependences of the temperature of semiconductor electronic components on the consumed electric power in the range from 13 to 36 W were obtained by using a calculation method. The experimental data were compared with those obtained due to the calculation.