Radioelectronic Apparatus Design with Optimal Reliability Indicators

Abstract

Introduction and problem statement. Considered the problem of maximizing the reliability of electronic structure elements of unit cells and entire electronic unit under the action of thermal destabilizing factors. Reliability of all device essentially depends from the thermal regime of electronic components, vibration and shock resistance. Optimization of the thermal regime of the cell can be achieved by an appropriate placement of the heat-producing elements, because the temperature of each of them is determined by convective, conductive and radiative connections with elements of construction and each other. Calculation of the cells average temrepatures in the block. Described calculation of the average temperature of cells in the block. Averaged temperature of the cell is determined by the temperature of the coolant (in most cases, the air), the cells placement in the block and the temperatures of their elements. Temperature calculation of the electronic structure elements and the reliability сalculations of cells and block. The calculation of the electronic structure elements temperatures and reliability of the cells and the block is considered. In each cell are usually set dozens of electronic structure elements, for each it is necessary to calculate the temperatures by which it is determined the reliability indicators. The optimization of the cells arrangement in the block. The optimization of the cells arrangement in the block is proposed. Heat generation in the cells in most designs is uneven, depending on the thermal power installed in them electronic structure elements, therefore, reliability indicators can be optimized, rationally placing the cells. For each accommodation option, the electronic structure elements temperature and the reliability of each cell are calculated. This is achieved through the specially created software package. Developed and described software modules for optimal placement of cells in the block to ensure that it has the minimum temperature of the electronic structure elements during operation. The design aim to reduce the temperature of heat-producing elements, and this can be achieved by appropriately placing the latter, removing them from each other to reduce interference and improve heat transfer. With a large number of cells in the block the rational placement it is difficult to achieve, since the number of non-repeatable placement of cells in a block is equal to the number of reconfigurations. Conclusions. The optimal cells arrangement in the block allows to obtain a design in which the maximum reliability is ensured. This is achieved by using a specially created software complex, which combines four software modules: BlockTermo2, InputData, Relia2015, OptimBlock.